Publications
Journal
Min Jin Yang, Hyunjo Chung, Yoonjin Kim, Kyungseo Park, and Jung Kim
IEEE Transactions on Robotics, 41 (2025)
Min Jin Yang, Kyungseo Park, Won Dong Kim, and Jung Kim
IEEE/ASME Transactions on Mechatronics, 29.4 (2024)
Kyungseo Park, Hyunwoo Yuk, Min Jin Yang, Junhwi Cho, Hyosang Lee, and Jung Kim
Science Robotics, 7.67 (2022)
Seulki Kyeong, Wonseok Shin, Min Jin Yang, Ung Heo, Ji-rou Feng, and Jung Kim
Frontiers of Information Technology & Electronic Engineering, 20.3 (2019)
Conference
[C7] Analysis on dynamic touch localisation algorithms in robotic skins using sparsely embedded microphones
Min Jin Yang and Jung Kim
Regular paper at ICROS 2024, Daejeon, South Korea
(** Best paper award)
Feng Jirou*, Min Jin Yang*, Seulki Kyeong, Yusung Kim, SeongHyeon Jo, Hyung-Soon Park, and Jung Kim (* Equally Contributed)
Regular paper at EMBC 2023, Sydney, Australia
Sungbin Park, Seojung Min, Junhwan Choi, Min Jin Yang, Dayoung Yeom, Wonseok Shin, Chaeree Park, and Jung Kim
Regular paper at UR 2023, Honolulu, USA
Min Jin Yang, Junhwi Cho, Hyunjo Chung, Kyungseo Park, and Jung Kim
Regular paper at ICRA 2023, London, United Kingdom
SeongHyeon Jo, Jun Ha Jung, Min Jin Yang, Yechan Lee, Sang Jin Jang, Jirou Feng, Si-Hwan Heo, Jung Kim, Joon-Ho Shin, Jaeseung Jeong, and Hyung-Soon Park
Regular paper at ICORR 2022, Rotterdam, Netherlands
Min Jin Yang, Kyungseo Park, and Jung Kim
Regular paper at ICRA 2021, Xi'an, China
[C1] Real time sEMG driven lower limb exoskeleton
Seulki Kyeong, Wonseok Shin, Ung Heo, Min Jin Yang, and Jung Kim
Late breaking result at IROS 2018, Madrid, Spain
Patent
[P2] Biomimetic tactile sensor, robotic skin comprising the same and preparation method thereof
Inventor : Jung Kim, Kyungseo Park, Min Jin Yang, and Junhwi Cho
(KR) Patent Number : 10-2614186 (Dec. 12, 2023)
(US) Application Number : 18/176,400 (Feb. 28, 2023)
[P1] Tactile sensor, and tactile stimulation sensing method using the same, and robot skin and robot comprising the same
Inventor : Jung Kim and Min Jin Yang
(KR) Patent Number : 10-2443421 (Sep. 08, 2022)
(JP) Patent Number : 7374188 (Oct. 26, 2023)
(US) Patent Number : 12,017,343 (Jun. 25, 2024)